Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
- Unstructured, Body-fitted Meshing
- Comprehensive Thermal Reliability Solution
- High-fidelity CFD Solver
Product Specs
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
- MCAD and ECAD Support
- Solar radiation
- Parametrics and Optimization
- Customization and Automation
- Network Modeling
- DC Joule Heating Analysis
- Electro-thermal and Thermo-Mechanical
- Extensive Libraries for Thermal
- Liquid Cooling
- Dynamic Thermal Management
- Varying Flow and Power ROM
Key Features
Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
- Electronics Desktop 3D layout GUI
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal
- Thermo-electric cooler modeling
- Package characterization
- Integrated graphical modeling environment